Converted Foam
Electronics Protection & Anti-static Foam
Electronics protection and anti-static foam is used for electronic component separation, cushioning, dust protection, clean handling, and applicable anti-static evaluation scenarios. Material and processing options can be matched to product structure, contact surface, packaging method, and protection needs.
- Density
- 18–55 kg/m³
- Hardness (F)
- 50–90°
- Pore structure
- 80–110 PPI
The above parameters represent typical available ranges. Final specifications should be confirmed based on samples, drawings, application environment, and testing requirements.
Forms, Customization & Applications
Common Forms
- pads
- strips
- liners
- adhesive-backed parts
- die-cut parts
- packaging inserts
Customization Options
- density
- hardness
- thickness
- color
- pore structure
- adhesive backing
- lamination
- die-cutting
- anti-static requirement review
Suitable Applications
- Electronic component separation
- Cushioning
- Dust protection
- Clean handling
- Packaging inserts
- Applicable anti-static review
Information for RFQ Review
- Drawing or sample photo
- Target dimensions and tolerance
- Required density, hardness, and pore structure
- Application position and assembly conditions
- Annual volume and packaging requirements
Need this type of foam material or component?
Send drawings, sample photos, target dimensions, material requirements, and annual volume. YUNDY can support material review, sample discussion, and production planning.